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2013 IEEE International Symposium on Phased Array Systems & Technology
15 - 18 October 2013 Waltham, Massachusetts USA
Tutorial: T/R Module Design and Calibration
T/R Module Design and Calibration Dr. William H. Weedon, Applied Radar, Inc., Dr. Leonard Johnson, MIT Lincoln Laboratory, Dr. Douglas J. Carlson, M/A-COM Technology Solutions Abstract 1 Emerging Component and Packaging Technology for Radar T/R Modules and Integrated Receiver/Exciters    This segment will discuss key component technologies for active electronically scanned array (AESA) radar systems including T/R modules and integrated digital receiver/exciters (DREXs). Monolithic integration is essential for next generation radar systems as T/R module and DREX functionalities are both implemented close to the element level. Radar integrated circuit (IC) technology continues to advance as measured by key performance metrics such as frequency of operation, bandwidth, dynamic range, and power-added efficiency. The tutorial will survey advanced IC technologies for T/R modules and DREXs, including mixed-signal SiGe and Si-CMOS ICs and GaN-based HPA MMICs. The development of an integrated SiGe X-band receiver/exciter chipset at AFRL and MIT/LL will be discussed. Abstract 2 Panel Based Approaches to Phased Array Radar   This session will focus on approaches to the design and manufacturing of panel based phased array radar using commercial plastic packaging and conventional commercial printed circuit board technologies.  The MPAR (Multifunction Phased Array Radar), an S-Band Dual Polarization radar for air traffic control and weather surveillance will be used as the demonstration vehicle.  Progress in the implementation of this system will be used to cover topics extending from MMICs to transmit receive modules to line replaceable units for the array face.  Approaches to extending the MPAR panel concept to much higher levels of radiated power per element through the implementation of plastic packaged GaN power devices and multistage GaN PCB power modules will be presented.  Through these approaches, affordable, high power (>100W/element) panel arrays based entirely on commercial printed circuit board and plastic packaged RF devices are possible. Abstract 3 COTS-Based Phased-Array T/R Module Architectures   This segment of the tutorial will focus on COTS-enabled phased-array architectures including traditional MMIC arrays, subarray digital beamforming, and element-level digital beamforming. We will discuss brick or slat vs tile architectures with traditional digitally-controlled MMIC arrays, including scaling of architecture with frequency, chip technologies including GaAs, SiGe and GaN, interconnect technologies, and array thermal dissipation. As we progress more towards digital arrays, we will discuss advances in digital receiver/exciter (DREX) technology, digital beamforming, and MIMO-based virtual arrays. A discussion of emerging T/R module architectures will be given including W-band and E-band arrays. Biography Dr. William H. Weedon founded Applied Radar, Inc in 1996 and for which he is currently the CEO. The company was originally started as a consulting company, but has grown significantly with the help of over 30 DoD SBIR contracts and other DoD and commercial work to over $6.0M annual revenues and 30 employees. Applied Radar specializes in the development of advanced radar systems, primarily for DoD customers such as the US Air Force, the US Army, US Navy, DARPA, SOCOM and MDA.   As CEO of Applied Radar, Inc., Dr. Weedon has served as Principal Investigator on numerous DoD research and development contracts in areas covering antenna design and modeling, RF transceiver development at X- band, Ku-band and W-band, high-speed real-time digital processing hardware, and radar and electronic system development. This has resulted in numerous publications, technical reports and several US patent applications.   Dr. Weedon received a BSEE degree in Electrical Engineering (Summa Cum Laude) in 1989 and MSEE in 1990 from Northeastern University and a Ph.D. in Electrical Engineering from the University of Illinois at Urbana-Champaign in 1994 under the direction of Prof. Weng Cho Chew. He is a member of the Tau Beta Pi, Phi Kappa Phi, Eta Kappa Nu honor societies, is formerly Co-Chairman (1999-2003) of the Boston section of the IEEE Antennas and Propagation Society, and is a member of the IEEE Microwave Theory and Techniques society. He was exhibit chairman for the 2003 IEEE Phased Array Symposium (Waltham, MA) and was also exhibit chairman for the 2007 Radar Conference in Boston, MA. He was the publicity chairman for the 2010 IEEE International Symposium on Phased Array Systems and Technology. Currently, he is the Conference Vice-Chair of the 2013 IEEE International Symposium on Phased Array Systems and Technology to be held in Waltham, MA in October 2013. Biography Dr. Leonard  M. Johnson is a Senior Member of the Technical Staff in the RF and Quantum Systems Technology Group at MIT Lincoln Laboratory. He has extensive experience in technology development for wideband RF mixed-signal systems. Dr. Johnson currently leads technology development efforts for highly- compact wideband digital receiver/exciter modules for phased-array radar applications. This effort encompasses the design of state-of-the-art silicon germanium integrated circuits, advanced multi-chip- module (MCM) packaging, and wideband digital firmware. In earlier efforts, Dr. Johnson pioneered key photonic technologies for wide-dynamic-range fiber-optic antenna remoting and optical beamforming systems. More recently, he has been engaged in applying microwave photonic technology to wideband signal processing applications. In addition, he has been engaged in numerous study efforts focused on advanced electronic technologies for DoD systems. Dr. Johnson received the BS, MS and PhD degrees from the Massachusetts Institute of Technology, all in Electrical Engineering.
Biography Dr. Douglas Carlson is focused on defining the business and market strategies of M/A-COM Technology Solutions with specific focus on the Government market.  In this capacity he is driving the development of semiconductor and T/R module technologies in support of radar and military communications applications.   Dr. Carlson joined M/A-COM, Inc., now M/A-COM Technology Solutions Inc., in 1990.  He has held Engineering, Operations and Product Line Management roles.  Dr. Carlson has been instrumental in the award and management of numerous Government R&D programs from the Army, Navy, Air Force, DARPA and Title III.  Prior to joining M/A-COM, Dr. Carlson was on the research staff at both MIT, Cambridge, MA and Bell Laboratory, Murray Hill, NJ.  He has published over 30 articles in peer reviewed journals and has been an invited speaker at numerous technical conferences.   Dr. Carlson holds a Bachelor of Science Degree in Electronics Materials received in 1983 from Brown University, Providence, RI and a Doctor of Science Degree in Electronic Materials received in 1989 from the Massachusetts Institute of Technology, Cambridge, MA.  He has been focused on RF materials and device technology for over 30 years.